Description:
The ASUS TUF GAMING H670‑PRO WIFI D4 is designed for gamers and PC builders seeking a durable and versatile platform. Powered by the Intel H670 chipset and LGA1700 socket, it supports both 12th and 13th Gen Intel Core processors. The board features a 14+1 DrMOS power design and military-grade components with ProCool connectors and a six-layer PCB to ensure stability during extended workloads. It supports DDR4 memory up to 5333 MHz (OC) and includes PCIe 5.0 for future GPU compatibility, along with four PCIe 4.0 M.2 slots (two supporting 22110) complete with heatsinks for fast and cool NVMe performance. Integrated Wi‑Fi 6, Bluetooth 5.2, and 2.5 Gb Ethernet ensure high-speed networking. A wide range of I/O options include USB 3.2 Gen 2×2 Type‑C, HDMI, DisplayPort, and Thunderbolt 4 readiness. Enhanced cooling, customizable RGB with Aura Sync, and comprehensive durability features make it a solid choice for performance and reliability .

Key Features:

• Supports 12th & 13th Gen Intel Core, Pentium, and Celeron (LGA1700)

• 14+1 DrMOS power stages, ProCool connectors, and six-layer PCB for stable power

• DDR4 support up to 5333 MHz (OC), max 128 GB

• PCIe 5.0 x16 slot + 4× PCIe 4.0 M.2 slots with heatsinks for high-speed storage

• Intel Wi‑Fi 6 and Bluetooth 5.2, 2.5 Gb LAN, and TUF LANGuard protection

• Rear USB 3.2 Gen 2×2 Type‑C (20 Gbps), front USB‑C Gen 1 header, and Thunderbolt 4 header

• 7.1 channel Realtek audio with optical S/PDIF and Q-LED diagnostics

• Aura Sync RGB and addressable headers for lighting control

• TUF Protection: SafeSlot, ESD guards, overvoltage protection, stainless I/O

• Extensive cooling: VRM & chipset heatsinks, hybrid fan headers, ASUS Fan Xpert 4

Key Specifications:

• Form Factor: ATX (305 × 244 mm)

• Chipset: Intel H670

• Memory: 4× DDR4 DIMM, Dual-channel, 128 GB max, up to 5333 MHz OC

• PCIe Slots: 1× PCIe 5.0 x16, 1× PCIe 3.0 x16 (x4), 2× PCIe 3.0 x1

• Storage: 4× M.2 (PCIe 4.0) + 4× SATA 6 Gb/s

• Network: Intel Wi‑Fi 6, Bluetooth 5.2, 2.5 Gb Ethernet

• Rear I/O: USB‑C Gen 2×2, USB 3.2 Gen 2 & Gen 1, HDMI, DisplayPort, 2.5 Gb LAN, audio jacks, optical S/PDIF

• Internal Headers: USB 3.2 Gen 1 & USB 2.0, front USB‑C Gen 1, Thunderbolt 4, RGB headers

• Audio: Realtek 7.1 HD codec

• Cooling: VRM heatsinks, M.2 heatsink, chipset heatsink, hybrid fan connectors